A new generation of ultrafast process technology coming to market
A Cloud-Piercing Laser
An ultra-hot laser creates a temporary hole in a cloud to improve optical communication
LIDE in the Lead
LaserMicronics processes ultra-thin glass with laser-induced deep etching
Beam Sources for Highly Productive Electronics Production
The joint project InBUS focuses on increasing efficiency, available output power, and flexibility of (U)SP laser sources
Laser Drilling of CFRP Components in Large Quantities
Customized processing strategies for applications in aviation
Turning the Hardest Materials Without Wear
New technology shapes work pieces with high precision in the µm range
Optimized Laser Pulses Drill Narrower and Deeper Holes
Modifying the temporal structure of ultrashort laser pulses allows high-aspect ratio nano-machining of fused silica
New Technology for Laser Drilling of Ceramic Films
Greater productivity with a divided laser beam