Productronica Innovation Award 2015

Falk Senger, Managing Director of Messe München, sees the award as an important source of momentum for the industry: “Electronics manufacturing is at the beginning of the value chain for electronics of the future – new technologies are developed and driven forward here. The large number of submissions shows how much innovative strength this industry has.”

F&K Delvotec wins productronica Innovation Award in the semiconductors cluster for the Laser bonder developed in cooperation with Fraunhofer ILT. (Source: Messe München)

F&K Delvotec wins productronica Innovation Award in the semiconductors cluster for the Laser bonder developed in cooperation with Fraunhofer ILT. (Source: Messe München)

Winner in the cluster semiconductors is F&K Delvotec for its laser bonder: Wire bonding is the leading technology to attach electrical contacts to semiconductor components. Not unlike a sewing machine, a wire bonder draws a wire from the semiconductor to the housing and welds it at both ends. This process is fast, reliable and extremely flexible. But there is a limit to the currents which can be passed. Laser welding, on the other hand, can attach wiring of almost any cross-section, but it requires pre-fabricated connector elements, making it less flexible. Why not take the best of both worlds and develop a Laser Bonder which is capable of welding thick wires to connect two points?

Dr. Farhad Farassat, CEO F&K Delvotec, about the award: “We are very proud to be honored with the productronica innovation award for our laser bonder. This machine was developed in cooperation with the Fraunhofer Institute for Laser Technology ILT in Aachen, which was as successful as it was enjoyable, all in the framework of a publicly funded R&D project. We are already overwhelmed with worldwide inquiries about this revolutionary technology.”

The winners in the other categories are:

Future Markets cluster: Asys for PULSE, a software solution that can be used to monitor a complete SMD production line from tablet and smart watch and operate all handling modules.

PCB & EMS cluster: Fuji Machine for the SmartFAB, a solution that completes automation and production concepts in the context of Industry 4.0 & IoT.

Cables, Coils & Hybrids cluster: Schleuniger for the CoaxCenter 6000, the first machine that enables micro-coaxial cables to be processed fully-automatically and with high precision.

SMT Cluster: Rehm Thermal for its reel-to-reel system with patented process chamber for optimal thermal processing of ribbon-shape, flexible substrates, such as LED strips or wearable electronics.

Submissions were evaluated by a prominent panel of judges. They were: Prof. Klaus-Dieter Lang from Fraunhofer IZM, Professor Mathias Nowottnick from Rostock University, Dr. Martin Oppermann from the Dresden University of Technology, Professor Lothar Pfitzner from Fraunhofer IISB, Dr. Eric Maiser from the VDMA and Christoph Stoppok from the ZVEI.

The productronica innovation award is the first independent award in the electronics manufacturing industry and is conveyed in close cooperation with the trade journal “productronic” of Hüthig Verlag. (Source: Messe München)

Links: Productronica, Messe München, GermanyF & K Delvotec Bondtechnik GmbH, Ottobrunn, GermanyFraunhofer Institut für Lasertechnik ILT, Aachen, GermanyAsys, Dornstadt, GermanyFuji Machine, Mainz-Kastel, GermanySchleuniger, Winkelhaid, GermanyRehm Thermal, Blaubeuren, Germany

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