Higher Power Nanosecond Lasers Cut Thicker Films, PCBs, and Flex Substrates

The new “AVIA 355-55” laser features a very high (150 kHz) pulse repetition rate, resulting in an average power of 55 W at 355 nm. The “AVIA 532-80” produces high (1 millijoule) pulse energy, which, together with a maximum pulse repetition rate of 80 kHz, translates into an average power of 80 watts.

The “AVIA” lasers are compact, rugged, vanadate lasers that are well-established in many microprocessing applications because of their superior performance. They deliver unmatched reliability and longevity through the use of Highly Accelerated Life Testing (HALT) protocols, which identify failure mechanisms so that they can be designed out. The individual production units are tested using Highly Accelerated Stress Screening (HASS) methods. Coherent is the only laser manufacturer to employ this HALT/HASS stress testing methodology, which identifies and eliminates potential reliability issues with products before they are shipped to the customer, without decreasing their useful life. This minimizes cost of ownership for these lasers.

The “AVIA” ultraviolet lasers are used for cutting flex substrates and thin printed circuit boards (PCBs) with high lateral resolution. Thanks to their high power, the cutting capabilities extends to thicker (> 200 µm) flex and multi-layer materials. The green lasers are used for scribing films, drilling holes and slots, and cutting flex substrates that efficiently absorb green wavelengths, including certain PCB substrates, semiconductors, and photovoltaic components. The 80 kHz repetition rate ensures high process throughput.

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