Fraunhofer IPMS Center Nanoelectronic Tech­nologies Cooperates with NextIn

User interface of the Aegis I Defect Inspection Tool. Assessable using a Remote Control System. (Source: Fh. IPMS)

User interface of the Aegis I Defect Inspection Tool. Assessable using a Remote Control System. (Source: Fh.-IPMS)

The Fraunhofer Institute for Photonic Microsystems IPMS has entered into a collaborative relationship with South Korean semiconductor equipment manufacturer NextIn. As part of the one-year cooperative effort, a new defect inspection system will be evaluated at the Center Nanoelectronic Technologies (CNT); the tool allows for the visual detection, automatic classification and characterization of different defect types on structured wafers.
The NextIn Aegis I Wafer Inspection System makes it possible to combine bright field and dark field imaging in one tool, which significantly increases the number of different applications in semiconductor research and development. Once the evaluation has been completed, NextIn will therefore offer a flexible metrology tool for the 2x nm technology node.
“As a research institution, this project creates synergy effects because this type of equipment is very important for the research and development of FEoL, MoL and BEoL processes. Additionally, this collaboration serves to expand our business relationships into Asia.” says Dr. Benjamin Uhlig, head of the Interconnects group at IPMS-CNT. (Source: Fraunhofer IPMS)

Links: Fraunhofer Institute for Photonic Microsystems IPMS

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